Wafer Archives - The Tech Revolutionist

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Applied Materials and A*STAR’s Institute of Microelectronics to Advance R&D in Fan-Out Wafer-Level Packaging

Applied Materials Inc. and the Institute of Microelectronics (IME), a world renowned research institute under the Agency for Science, Technology and Research (A*STAR) have announced a five-year extension of their research collaboration at the Centre of Excellence in Advanced Packaging in Singapore. With an anticipated additional S$188 million of…

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