Applied Materials Inc. and the Institute of Microelectronics (IME), a world renowned research institute under the Agency for Science, Technology and Research (A*STAR) have announced a five-year extension of their research collaboration at the Centre of Excellence in Advanced Packaging in Singapore.
With an anticipated additional S$188 million of combined investment, the organizations will expand the scope of their R&D collaboration to focus on advancing Fan-Out Wafer-Level Packaging (FOWLP), a key technology inflection expected to help make chips and end-user devices smaller, faster and more power efficient.
With the Internet of Things (IoT) and Big Data being driving forces in today’s market, FOWLP acts as a key technology platform that enables multiple chips to be integrated in a small form factor on a single package. With FOWLP capable of providing significant benefits for the mobile and wireless markets, increased investment in the sector could help propel Singapore’s standing as a global hub for semiconductor R&D.
Applied Materials and A*STAR’s Institute of Microelectronics
to Advance R&D in Fan-Out Wafer-Level Packaging
- The organizations announce a five-year extension of their
research collaboration at the Centre of Excellence in Advanced Packaging in
Singapore - Fan-Out Wafer-Level Packaging is a key technology
inflection in the semiconductor industry expected to help make chips and
end-user devices smaller, faster and more power efficient - Joint R&D
Centre set to meet growing demand for use of fan-out multi-die packaging in
mobile devices
SINGAPORE, September 20, 2016, Applied Materials, Inc. and
the Institute of Microelectronics (IME), a world renowned research institute
under the Agency for Science, Technology and Research (A*STAR), today announced
a five-year extension of their research collaboration at the Centre of
Excellence in Advanced Packaging in Singapore. The organizations will expand
the scope of their R&D collaboration to focus on advancing Fan-Out
Wafer-Level Packaging (FOWLP), a key technology inflection expected to help
make chips and end-user devices smaller, faster and more power efficient.
the Institute of Microelectronics (IME), a world renowned research institute
under the Agency for Science, Technology and Research (A*STAR), today announced
a five-year extension of their research collaboration at the Centre of
Excellence in Advanced Packaging in Singapore. The organizations will expand
the scope of their R&D collaboration to focus on advancing Fan-Out
Wafer-Level Packaging (FOWLP), a key technology inflection expected to help
make chips and end-user devices smaller, faster and more power efficient.
With an anticipated additional S$188 million of combined
investment, the Centre will expand to a second location at Fusionopolis 2, in
addition to the existing facility at Singapore’s Science Park II. The two
facilities combined will span an area of approximately 1,700 square meters and
be staffed by a team of close to 100 researchers, scientists and engineers. The
Centre was built to develop new capabilities in advanced packaging through a
full line of Applied Materials’ Wafer-Level Packaging (WLP) processing equipment,
and has successfully delivered advancements in semiconductor hardware, process
and device structures.
investment, the Centre will expand to a second location at Fusionopolis 2, in
addition to the existing facility at Singapore’s Science Park II. The two
facilities combined will span an area of approximately 1,700 square meters and
be staffed by a team of close to 100 researchers, scientists and engineers. The
Centre was built to develop new capabilities in advanced packaging through a
full line of Applied Materials’ Wafer-Level Packaging (WLP) processing equipment,
and has successfully delivered advancements in semiconductor hardware, process
and device structures.
“Our collaboration with A*STAR over the past five years has
been instrumental in establishing Applied Materials’ presence in Singapore and
building up our R&D capabilities,” said Russell Tham, Regional President,
Applied Materials South East Asia. “With the entire R&D value stream from
ideation to product development being carried out locally via this joint lab,
the expansion will further Applied Materials’ development of new technologies
and products for global markets, while remaining a key contributor to
Singapore’s innovation economy.”
been instrumental in establishing Applied Materials’ presence in Singapore and
building up our R&D capabilities,” said Russell Tham, Regional President,
Applied Materials South East Asia. “With the entire R&D value stream from
ideation to product development being carried out locally via this joint lab,
the expansion will further Applied Materials’ development of new technologies
and products for global markets, while remaining a key contributor to
Singapore’s innovation economy.”
Dr. Raj. Thampuran, Managing Director, A*STAR, said, “Our
relationship with Applied Materials transcends a new milestone with the
extension of our collaboration in R&D into new areas. The progress we have
made from our initial collaboration is a testament to the successful
partnership A*STAR has with Applied Materials. As we look towards the future,
we remain committed to advancing innovations in the semiconductor industry and
being at the forefront of leading edge ideas in this rapidly evolving
technological landscape.”
relationship with Applied Materials transcends a new milestone with the
extension of our collaboration in R&D into new areas. The progress we have
made from our initial collaboration is a testament to the successful
partnership A*STAR has with Applied Materials. As we look towards the future,
we remain committed to advancing innovations in the semiconductor industry and
being at the forefront of leading edge ideas in this rapidly evolving
technological landscape.”
The Internet of Things (IoT) and Big Data are driving forces
in today’s market of interconnected and multi-functional electronic devices.
FOWLP is considered a key technology platform for system scaling, enabling
multiple chips to be integrated in a small form factor on a single package.
With FOWLP capable of providing significant benefits for the mobile and
wireless markets, increased investment in the sector could help propel
Singapore’s standing as a global hub for semiconductor R&D. Through a
successful alliance with its private sector partners across the value chain,
A*STAR has contributed to Singapore’s vibrant research, innovation and
enterprise ecosystem. In 2014, A*STAR and 10 other industry partners launched
four Advanced Semiconductor Joint Labs to provide an integrated platform for
complex microchip manufacturing R&D. These global partnerships together
with the Applied Materials – A*STAR joint R&D Centre will continue to
strengthen Singapore’s capabilities in semiconductor R&D and contribute to
the creation of high-value jobs and competitiveness of the industry.
in today’s market of interconnected and multi-functional electronic devices.
FOWLP is considered a key technology platform for system scaling, enabling
multiple chips to be integrated in a small form factor on a single package.
With FOWLP capable of providing significant benefits for the mobile and
wireless markets, increased investment in the sector could help propel
Singapore’s standing as a global hub for semiconductor R&D. Through a
successful alliance with its private sector partners across the value chain,
A*STAR has contributed to Singapore’s vibrant research, innovation and
enterprise ecosystem. In 2014, A*STAR and 10 other industry partners launched
four Advanced Semiconductor Joint Labs to provide an integrated platform for
complex microchip manufacturing R&D. These global partnerships together
with the Applied Materials – A*STAR joint R&D Centre will continue to
strengthen Singapore’s capabilities in semiconductor R&D and contribute to
the creation of high-value jobs and competitiveness of the industry.
The Singapore Centre conducts WLP research across Applied
Materials for its global customers. The Centre undertakes complex
multi-disciplinary research to develop new innovations in advanced packaging
including bump, TSV, 2.5D interposers and now FOWLP. Through its work at the
Centre, Applied Materials has developed technology that has been successfully
implemented in several of its semiconductor equipment products. In addition,
the extension of the collaboration highlights the important role a successful
public-private partnership plays in creating value and building up
differentiated competencies for Singapore.
Materials for its global customers. The Centre undertakes complex
multi-disciplinary research to develop new innovations in advanced packaging
including bump, TSV, 2.5D interposers and now FOWLP. Through its work at the
Centre, Applied Materials has developed technology that has been successfully
implemented in several of its semiconductor equipment products. In addition,
the extension of the collaboration highlights the important role a successful
public-private partnership plays in creating value and building up
differentiated competencies for Singapore.
“Applied Materials’ leading expertise in materials
engineering drives the development of highly differentiated products and
solutions that make new technologies possible,” said Dr. Prabu Raja, Group Vice
President and General Manager of the Patterning and Packaging Group, Applied
Materials. “We are excited to expand our collaboration with A*STAR and leverage
our complementary strengths to solve challenges in advanced packaging and build
new capabilities for future innovations.”
engineering drives the development of highly differentiated products and
solutions that make new technologies possible,” said Dr. Prabu Raja, Group Vice
President and General Manager of the Patterning and Packaging Group, Applied
Materials. “We are excited to expand our collaboration with A*STAR and leverage
our complementary strengths to solve challenges in advanced packaging and build
new capabilities for future innovations.”
A*STAR takes a long-term vision towards strategic
investments in industry-ready R&D that contribute to Singapore’s economic
growth. It is home to one of the premier advanced packaging and wafer-level
packaging research facilities in Asia. IME’s leading research capabilities in
advanced chip packaging are focused on meeting the challenging requirements in
complex and sophisticated chip packaging, in order to develop slimmer devices
with greater system capabilities such as ultra-low power consumption, increased
memory and bandwidth, and diverse functionality.
investments in industry-ready R&D that contribute to Singapore’s economic
growth. It is home to one of the premier advanced packaging and wafer-level
packaging research facilities in Asia. IME’s leading research capabilities in
advanced chip packaging are focused on meeting the challenging requirements in
complex and sophisticated chip packaging, in order to develop slimmer devices
with greater system capabilities such as ultra-low power consumption, increased
memory and bandwidth, and diverse functionality.
Dr. Tan Yong Tsong, Executive Director, IME, said, “Our long
standing collaboration with Applied Materials demonstrates the value of
public-private partnership under open innovation, and underscores the readiness
and competitiveness of IME’s research capabilities for the industry. Through
this joint lab, we will continue to push the envelope through our
differentiated R&D competencies to deliver breakthrough technologies.”
standing collaboration with Applied Materials demonstrates the value of
public-private partnership under open innovation, and underscores the readiness
and competitiveness of IME’s research capabilities for the industry. Through
this joint lab, we will continue to push the envelope through our
differentiated R&D competencies to deliver breakthrough technologies.”
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