Delta Electronics has signed a Memorandum of Understanding (MOU) with the National University of Singapore’s College of Design and Engineering (CDE) to push the boundaries of microelectronics through joint research and development.
The partnership will focus on hybrid integration of microelectronics and photonics packaging, aiming to accelerate breakthroughs that could shape the future of next-generation technologies. And through this 3-year collab, both parties aim to co-develop research projects, host exchange programs, participate in conferences, and share academic and technical expertise. These efforts are designed to bridge industry experience with academic innovation, strengthening Singapore’s position as a hub for deep-tech research and advanced engineering.
“Photonics packaging and integration is emerging as the backbone of advanced sensing to modern connectivity,” said PS Tang, General Manager of Delta Electronics Singapore. “Our collaboration with NUS combines academic research and industry know-how to accelerate breakthroughs that can be scaled into real-world applications, while nurturing future-ready talent.”
CDE Dean Professor Teo Kie Leong echoed this sentiment, emphasizing the spirit of collaboration. “Venues like the Singapore Hybrid-Integrated Next Generation µElectronics (SHINE) Centre bring together multiple institutions in partnership with industry to deliver cutting-edge innovation. This partnership with Delta embodies collaboration, innovation, and real-world relevance.”
Together, the two organizations aim to turn research into tangible solutions that drive technological progress and support Singapore’s ambition to lead in deep-tech innovation.
