BIOSTAR has announced a strategic partnership with Taiwanese IPC solution provider Netio to strengthen the global distribution of its EdgeComp product line. The two companies will present their joint offerings at Taiwan Expo USA 2025, taking place from August 14 to 16 at the Kay Bailey Hutchison Convention Center in Dallas, Texas (Hall A, Booth #313).
The collaboration is focused on expanding integrated edge computing solutions for industrial sectors such as smart manufacturing, smart cities, smart retail, and intelligent control systems. By combining BIOSTAR’s hardware expertise with Netio’s integration capabilities, the partnership aims to deliver more accessible and scalable edge computing platforms worldwide.
At the event, Biostar and Netio will showcase a lineup of industrial motherboards, including the BIADN-IHT, BITWL-150, BIRPL-PAT, and BIW88-AHS. These compact boards are designed for high-demand applications such as automation controllers, industrial imaging systems, and real-time data processing.
Complementing them are Biostar’s fanless edge systems: the rugged EdgeComp MS-X7433RE, capable of extended temperature operation, and the energy-efficient EdgeComp MS-1335U, a slim embedded IPC tailored for smart kiosks, gateways, and digital signage.
Industry stakeholders, media, and attendees are invited to visit Booth #313 to view product demonstrations and explore collaboration opportunities.
