AMD announced today that in collaboration with its global ecosystem of server customers and partners, it has launched the EPYC 7000 series of high-performance datacenter processors.
With up to 32 high-performance “Zen” cores and an unparalleled feature set, the record-setting AMD EPYC design delivers greater performance across a full range of integer, floating point, memory bandwidth, and I/O benchmarks and workloads.
EPYC Product Overview
· A highly scalable System on Chip (SoC) design ranging from 8-core to 32-core, supporting two high-performance threads per core.
· Industry-leading memory bandwidth across the line-up, with 8 channels of memory on every EPYC device. In a two-socket server, support for up to 32 DIMMS of DDR4 on 16 memory channels, delivering up to 4 terabytes of total memory capacity.
· Unprecedented support for integrated, high-speed I/O with 128 lanes of PCIe® 3 on every product
· A highly-optimized cache structure for high-performance, energy efficient compute
· AMD Infinity Fabric coherent interconnect linking EPYC CPUs in a two-socket system
· Dedicated security hardware
Please visit the AMD EPYC landing page for more details.
AMD EPYC™ Datacenter
Processor Launches with Record-Setting Performance, Optimized Platforms, and
Global Server Ecosystem Support
Processor Launches with Record-Setting Performance, Optimized Platforms, and
Global Server Ecosystem Support
─ Dell, HPE, Lenovo, Mellanox, Samsung
Electronics, Supermicro, VMware, Xilinx, and many others form strong global ecosystem
for EPYC™ processors ─
Electronics, Supermicro, VMware, Xilinx, and many others form strong global ecosystem
for EPYC™ processors ─
─ Cloud datacenter customers Microsoft
Azure and Baidu announce deployments ─
Azure and Baidu announce deployments ─
AUSTIN, Texas — June 20, 2017 — AMD
(NASDAQ: AMD), and a
global ecosystem of server partners, today marked a new era in the datacenter with
the launch of AMD EPYC™ 7000 series high-performance datacenter processors. AMD
was joined by multiple customers and partners at the global launch event in presenting
a wide array of systems, performance demonstrations, and customer testimonials.
The innovative, record-setting AMD EPYC design, with up to 32 high-performance
“Zen” cores and an unparalleled feature set, delivers greater performance than
the competition across a full range of integer, floating point, memory
bandwidth, and I/O benchmarks and workloads.
(NASDAQ: AMD), and a
global ecosystem of server partners, today marked a new era in the datacenter with
the launch of AMD EPYC™ 7000 series high-performance datacenter processors. AMD
was joined by multiple customers and partners at the global launch event in presenting
a wide array of systems, performance demonstrations, and customer testimonials.
The innovative, record-setting AMD EPYC design, with up to 32 high-performance
“Zen” cores and an unparalleled feature set, delivers greater performance than
the competition across a full range of integer, floating point, memory
bandwidth, and I/O benchmarks and workloads.
“With our EPYC family of processors, AMD
is delivering industry-leading performance on critical enterprise, cloud, and
machine intelligence workloads,” said Lisa Su, president and CEO, AMD. “EPYC
processors offer uncompromising performance for single-socket systems while
scaling dual-socket server performance to new heights, outperforming the
competition at every price point. We are proud to bring choice and innovation
back to the datacenter with the strong support of our global ecosystem partners.”
is delivering industry-leading performance on critical enterprise, cloud, and
machine intelligence workloads,” said Lisa Su, president and CEO, AMD. “EPYC
processors offer uncompromising performance for single-socket systems while
scaling dual-socket server performance to new heights, outperforming the
competition at every price point. We are proud to bring choice and innovation
back to the datacenter with the strong support of our global ecosystem partners.”
The world’s
largest server manufacturers introduced products based on AMD EPYC 7000-series
processors at today’s launch, including HPE, Dell, Asus, Gigabyte, Inventec,
Lenovo, Sugon, Supermicro, Tyan, and Wistron. Primary hypervisor and server operating
system providers Microsoft, Red Hat, and VMware showcased optimized support for
EPYC, while key server hardware ecosystem partners Mellanox, Samsung
Electronics, and Xilinx were also featured in EPYC-optimized platforms.
largest server manufacturers introduced products based on AMD EPYC 7000-series
processors at today’s launch, including HPE, Dell, Asus, Gigabyte, Inventec,
Lenovo, Sugon, Supermicro, Tyan, and Wistron. Primary hypervisor and server operating
system providers Microsoft, Red Hat, and VMware showcased optimized support for
EPYC, while key server hardware ecosystem partners Mellanox, Samsung
Electronics, and Xilinx were also featured in EPYC-optimized platforms.
Leading Server OEM Platforms
“The
EPYC processor represents a paradigm shift in computing and will usher in a new
era for the IT ecosystem,” said Antonio Neri, EVP and general manager
Enterprise Group, HPE. “Starting with the Cloudline CL3150 and expanding into
other product lines later this year, the arrival of EPYC in HPE systems will be
welcomed by customers who are eager to deploy the performance and innovation
EPYC delivers.”
EPYC processor represents a paradigm shift in computing and will usher in a new
era for the IT ecosystem,” said Antonio Neri, EVP and general manager
Enterprise Group, HPE. “Starting with the Cloudline CL3150 and expanding into
other product lines later this year, the arrival of EPYC in HPE systems will be
welcomed by customers who are eager to deploy the performance and innovation
EPYC delivers.”
“As an
industry leader, we are committed to driving IT Transformation for our
customers,” said Ashley Gorakhpurwalla, president, server solutions division
at Dell EMC, “Our next generation of PowerEdge servers are the bedrock of the
modern data center that are designed to maximize business scalability and
intelligent automation with integrated security. The combination of PowerEdge
and the AMD EPYC performance and security capabilities will create unique
compute solutions for our customers to accelerate workloads and protect their
business.”
industry leader, we are committed to driving IT Transformation for our
customers,” said Ashley Gorakhpurwalla, president, server solutions division
at Dell EMC, “Our next generation of PowerEdge servers are the bedrock of the
modern data center that are designed to maximize business scalability and
intelligent automation with integrated security. The combination of PowerEdge
and the AMD EPYC performance and security capabilities will create unique
compute solutions for our customers to accelerate workloads and protect their
business.”
Cloud Datacenter and Enterprise
Customers
Customers
Datacenter and cloud service providers
also welcomed EPYC to the market today. Members of the “Super 7” datacenter
services providers, including Baidu and Microsoft Azure, as well as 1&1,
Bloomberg, Dropbox and LexisNexis, all voiced their support at launch.
also welcomed EPYC to the market today. Members of the “Super 7” datacenter
services providers, including Baidu and Microsoft Azure, as well as 1&1,
Bloomberg, Dropbox and LexisNexis, all voiced their support at launch.
“As the world’s largest Chinese language
search engine and leading AI-Tech company, Baidu prides itself on simplifying a
complex world through technology,” said By Dr. Zhang Ya Qin, president of
Baidu. “The AMD EPYC processor powered one-socket server can significantly increase
our datacenter computing efficiency, reduce TCO and lower energy consumption.
We will start deploying with the launch of AMD EPYC and I look forward to our
cooperation leading to scaled EPYC adoption this year, and ongoing
innovations.”
search engine and leading AI-Tech company, Baidu prides itself on simplifying a
complex world through technology,” said By Dr. Zhang Ya Qin, president of
Baidu. “The AMD EPYC processor powered one-socket server can significantly increase
our datacenter computing efficiency, reduce TCO and lower energy consumption.
We will start deploying with the launch of AMD EPYC and I look forward to our
cooperation leading to scaled EPYC adoption this year, and ongoing
innovations.”
“We’ve
worked to make Microsoft Azure a powerful enterprise grade cloud platform, that
helps guide the success of our customers, no matter their size or geography,”
said Girish Bablani, corporate vice president, Azure Compute, Microsoft Corp.
“To power Azure, we require the most cutting-edge infrastructure and the latest
advances in silicon which is why we intend to be the first global cloud
provider to deliver AMD EPYC, and its combination of high performance and
value, to customers.
worked to make Microsoft Azure a powerful enterprise grade cloud platform, that
helps guide the success of our customers, no matter their size or geography,”
said Girish Bablani, corporate vice president, Azure Compute, Microsoft Corp.
“To power Azure, we require the most cutting-edge infrastructure and the latest
advances in silicon which is why we intend to be the first global cloud
provider to deliver AMD EPYC, and its combination of high performance and
value, to customers.
Record-Setting EPYC Performance
The
excitement around EPYC is driven by multiple record-setting server benchmarks
achieved by EPYC-powered one-socket and two-socket systems.
excitement around EPYC is driven by multiple record-setting server benchmarks
achieved by EPYC-powered one-socket and two-socket systems.
AMD EPYC
processors set several performance records, including:
processors set several performance records, including:
·
Two-Socket
Server
Two-Socket
Server
·
AMD
EPYC 7601-based system scored 2360 on SPECint®_rate2006, higher than any other two-socket
system score1
AMD
EPYC 7601-based system scored 2360 on SPECint®_rate2006, higher than any other two-socket
system score1
·
One-Socket
Server
One-Socket
Server
·
AMD
EPYC™ 7601-based system scored 1200 on SPECint®_rate2006, higher than any other
mainstream one-socket x86-based system score2
AMD
EPYC™ 7601-based system scored 1200 on SPECint®_rate2006, higher than any other
mainstream one-socket x86-based system score2
·
AMD
EPYC 7601-based system scored 943 on SPECfp®_rate2006, higher than any other one-socket
system score3
AMD
EPYC 7601-based system scored 943 on SPECfp®_rate2006, higher than any other one-socket
system score3
All EPYC processors combine innovative
security features, enterprise class reliability, and support a full feature-set.
An AMD EPYC™ 7601 CPU-based one-socket system shifts expectations for single socket
server performance, helping lower total-cost-of-ownership (TCO), providing up
to 20% CapEx savings compared to the Intel Xeon E5-2660 v4-based two-socket
system4. At every targeted price point for two-socket processors,
EPYC outperforms the competition, with up to 70% more performance in the eight hundred
dollar price band and up to 47% more performance at the high-end of the market
of four thousand dollars or more5.
security features, enterprise class reliability, and support a full feature-set.
An AMD EPYC™ 7601 CPU-based one-socket system shifts expectations for single socket
server performance, helping lower total-cost-of-ownership (TCO), providing up
to 20% CapEx savings compared to the Intel Xeon E5-2660 v4-based two-socket
system4. At every targeted price point for two-socket processors,
EPYC outperforms the competition, with up to 70% more performance in the eight hundred
dollar price band and up to 47% more performance at the high-end of the market
of four thousand dollars or more5.
EPYC Product Overview
·
A
highly scalable System on Chip (SoC) design ranging from 8-core to 32-core,
supporting two high-performance threads per core.
A
highly scalable System on Chip (SoC) design ranging from 8-core to 32-core,
supporting two high-performance threads per core.
·
Industry-leading
memory bandwidth across the line-up, with 8 channels of memory on every EPYC
device. In a two-socket server, support for up to 32 DIMMS of DDR4 on 16 memory
channels, delivering up to 4 terabytes of total memory capacity.
Industry-leading
memory bandwidth across the line-up, with 8 channels of memory on every EPYC
device. In a two-socket server, support for up to 32 DIMMS of DDR4 on 16 memory
channels, delivering up to 4 terabytes of total memory capacity.
·
Unprecedented
support for integrated, high-speed I/O with 128 lanes of PCIe® 3 on every
product
Unprecedented
support for integrated, high-speed I/O with 128 lanes of PCIe® 3 on every
product
·
A
highly-optimized cache structure for high-performance, energy efficient compute
A
highly-optimized cache structure for high-performance, energy efficient compute
·
AMD
Infinity Fabric coherent interconnect linking EPYC CPUs in a two-socket system
AMD
Infinity Fabric coherent interconnect linking EPYC CPUs in a two-socket system
·
Dedicated
security hardware
Dedicated
security hardware
EPYC Product Lineup
Model
|
Core / Thread
|
Base Freq.
|
Max Boost
|
TDP
|
EPYC™ 7601
|
32 / 64
|
2.2 GHz
|
3.2 GHz
|
180W
|
EPYC™
7551P |
32 / 64
|
2.0 GHz
|
3.0 GHz
|
180W
|
EPYC™ 7501
|
32 / 64
|
2.0 GHz
|
3.0 GHz
|
155/170W
|
EPYC™ 7451
|
24 / 48
|
2.3 GHz
|
3.2 GHz
|
180W
|
EPYC™
7401P |
24 / 48
|
2.0 GHz
|
3.0 GHz
|
155/170W
|
EPYC™
7351P |
16 / 32
|
2.4 GHz
|
2.9 GHz
|
155/170W
|
EPYC™ 7301
|
16 / 32
|
2.2 GHz
|
2.7 GHz
|
155/170W
|
EPYC™ 7281
|
16 / 32
|
2.1 GHz
|
2.7 GHz
|
155/170W
|
EPYC™ 7251
|
8 / 16
|
2.1 GHz
|
2.9 GHz
|
120W
|
Additional Resources
·
EPYC on AMD.com
EPYC on AMD.com
·
Follow AMD datacenter developments on Twitter @AMDServer
Follow AMD datacenter developments on Twitter @AMDServer
Cloud Service Provider Support
Bloomberg
“At Bloomberg, we handle the
flow of information for professionals in the capital markets. We look forward
to AMD’s leadership in the open standards communities, such as OCP, NVMe, GenZ,
and CCIX, to help accelerate the industry-wide adoption of these innovative
data center, storage, and interconnect solutions,” said Justin Erenkrantz, head
of compute architecture for Bloomberg, the global finance, media and tech
company based in New York City. “With higher density and lower latency NVMe
storage a primary feature delivered by the AMD EPYC processor, we fully expect
to realize the next level of performance and cost efficiency.”
flow of information for professionals in the capital markets. We look forward
to AMD’s leadership in the open standards communities, such as OCP, NVMe, GenZ,
and CCIX, to help accelerate the industry-wide adoption of these innovative
data center, storage, and interconnect solutions,” said Justin Erenkrantz, head
of compute architecture for Bloomberg, the global finance, media and tech
company based in New York City. “With higher density and lower latency NVMe
storage a primary feature delivered by the AMD EPYC processor, we fully expect
to realize the next level of performance and cost efficiency.”
Dropbox
“Dropbox customers expect fast, reliable access to
the content they ask us to manage for them and EPYC delivers on those
requirements. We have worked closely with AMD during our evaluation of EPYC in
our environment and see significant potential in lowering
total-cost-of-ownership while improving performance in single-socket
designs,” said Akhil
Gupta, vice president of infrastructure at Dropbox. “Our evaluation systems
take advantage of the industry-leading 128 lanes of PCIe on EPYC for storage
performance and capacity. Dropbox is exploring deployment options for EPYC
later this year, and I believe the future looks bright for the relationship
with AMD and EPYC.”
the content they ask us to manage for them and EPYC delivers on those
requirements. We have worked closely with AMD during our evaluation of EPYC in
our environment and see significant potential in lowering
total-cost-of-ownership while improving performance in single-socket
designs,” said Akhil
Gupta, vice president of infrastructure at Dropbox. “Our evaluation systems
take advantage of the industry-leading 128 lanes of PCIe on EPYC for storage
performance and capacity. Dropbox is exploring deployment options for EPYC
later this year, and I believe the future looks bright for the relationship
with AMD and EPYC.”
LexisNexis
At
LexisNexis® Risk Solutions, we believe in the power of data and advanced
analytics for better risk management. As a trusted data analytics provider for
organizations seeking actionable insights to manage risks and improve results
while upholding the highest standards for security and privacy,” said Flavio
Villanustre, vice president, Technology, LexisNexis Risk Solutions, RELX Group.
“LexisNexis processes more than 90 million transactions per hour with HPCC
Systems®, a proven, open source solution for Big Data. LexisNexis Risk
Solutions and AMD have teamed up to optimize the HPCC Systems platform to take
advantage of the benefits of thread density, core performance, memory bandwidth
and the industry leading 128 lanes of PCIe per socket of the AMD EPYC
processor.”
LexisNexis® Risk Solutions, we believe in the power of data and advanced
analytics for better risk management. As a trusted data analytics provider for
organizations seeking actionable insights to manage risks and improve results
while upholding the highest standards for security and privacy,” said Flavio
Villanustre, vice president, Technology, LexisNexis Risk Solutions, RELX Group.
“LexisNexis processes more than 90 million transactions per hour with HPCC
Systems®, a proven, open source solution for Big Data. LexisNexis Risk
Solutions and AMD have teamed up to optimize the HPCC Systems platform to take
advantage of the benefits of thread density, core performance, memory bandwidth
and the industry leading 128 lanes of PCIe per socket of the AMD EPYC
processor.”
OEM / ODM Support
ASUS
“We
recognized early on the significant performance and scalability potential of
EPYC for a number of ASUS platforms spanning HPC and virtualization workloads,”
said Robert Chin, head of ASUS Server business unit. “As a longtime AMD
technology partner, we are thrilled to design EPYC-based products that will
transform the datacenter experience and TCO for our customers.”
recognized early on the significant performance and scalability potential of
EPYC for a number of ASUS platforms spanning HPC and virtualization workloads,”
said Robert Chin, head of ASUS Server business unit. “As a longtime AMD
technology partner, we are thrilled to design EPYC-based products that will
transform the datacenter experience and TCO for our customers.”
Gigabyte Technology
“GIGABYTE Technology is
committed to pushing design boundaries in the enterprise server market, and
with the AMD EPYC CPU we can take the customer experience to the next level
with a single socket solution,” said Daniel Hou, vice president, Research &
Development, GIGABYTE Technology. “By packing increased performance, memory bandwidth
and I/O into a smaller footprint, EPYC will enable us to expand our portfolio
and address channel partners and system integrators in new target markets.”
committed to pushing design boundaries in the enterprise server market, and
with the AMD EPYC CPU we can take the customer experience to the next level
with a single socket solution,” said Daniel Hou, vice president, Research &
Development, GIGABYTE Technology. “By packing increased performance, memory bandwidth
and I/O into a smaller footprint, EPYC will enable us to expand our portfolio
and address channel partners and system integrators in new target markets.”
Inventec
“Inventec
is dedicated to driving innovation in a number of industries by combining AMD
CPU and GPU technologies on our platforms, and AMD is a key technology partner
for Inventec in the cloud datacenter market,” said Jack Tsai, general manager
of Inventec EBG. “By integrating the new EPYC CPU into our server portfolio, we
can provide a more competitive, scalable and higher performance solution to our
worldwide datacenter customers.”
is dedicated to driving innovation in a number of industries by combining AMD
CPU and GPU technologies on our platforms, and AMD is a key technology partner
for Inventec in the cloud datacenter market,” said Jack Tsai, general manager
of Inventec EBG. “By integrating the new EPYC CPU into our server portfolio, we
can provide a more competitive, scalable and higher performance solution to our
worldwide datacenter customers.”
Lenovo
“The
AMD EPYC processors present unique opportunities for our customers to lower
Total Cost of Ownership via an unprecedented balance of cores, memory
bandwidth, and I/O. We are excited to collaborate with AMD and several
global Hyperscale customers to develop and deploy single socket and dual socket
EPYC-based servers,” said Paul Ju, vice president and general manager, Lenovo
Global Hyperscale Business.
AMD EPYC processors present unique opportunities for our customers to lower
Total Cost of Ownership via an unprecedented balance of cores, memory
bandwidth, and I/O. We are excited to collaborate with AMD and several
global Hyperscale customers to develop and deploy single socket and dual socket
EPYC-based servers,” said Paul Ju, vice president and general manager, Lenovo
Global Hyperscale Business.
Supermicro
“Supermicro’s new generation
of server solutions supporting AMD EPYC processors will unlock many opportunities for datacenter
customers to leverage these innovative platforms,” said Don Clegg, vice president
of Marketing and Business Development at Supermicro. “AMD EPYC processors with
more cores, more memory bandwidth, and more I/O integrate effortlessly with our
Supermicro application-optimized platforms to provide leadership performance
per-watt and per-dollar to optimize data center TCO. We are delighted to
embrace this opportunity to strengthen and grow our mutually productive
technology partnership with AMD.”
of server solutions supporting AMD EPYC processors will unlock many opportunities for datacenter
customers to leverage these innovative platforms,” said Don Clegg, vice president
of Marketing and Business Development at Supermicro. “AMD EPYC processors with
more cores, more memory bandwidth, and more I/O integrate effortlessly with our
Supermicro application-optimized platforms to provide leadership performance
per-watt and per-dollar to optimize data center TCO. We are delighted to
embrace this opportunity to strengthen and grow our mutually productive
technology partnership with AMD.”
Tyan
“Tyan has a long history of
supporting AMD, and we are excited about the impact the company’s return to the
datacenter market will have on our customers,” said Danny Hsu, vice president
of MiTAC Computing Technology Corporation’s TYAN Business Unit. “We see major
promise for storage and HPC platforms with the EPYC CPU, as well as new
possibilities for combined GPU solutions, enabling a wide array of new
applications for customers around the globe.”
supporting AMD, and we are excited about the impact the company’s return to the
datacenter market will have on our customers,” said Danny Hsu, vice president
of MiTAC Computing Technology Corporation’s TYAN Business Unit. “We see major
promise for storage and HPC platforms with the EPYC CPU, as well as new
possibilities for combined GPU solutions, enabling a wide array of new
applications for customers around the globe.”
Wistron
“Wistron is glad to work with
AMD to provide the most cost-effective all-flash array storage solutions for
businesses competing in a constantly changing technology landscape,” said Peter
Tung, chief operation officer of Enterprise Business Group, Wistron. “The value
proposition for AMD’s EPYC CPU, particularly in non-volatile memory storage
applications, is a major differentiator, and enables datacenter and enterprise
customers to achieve high IOPS and throughput storage solutions.”
AMD to provide the most cost-effective all-flash array storage solutions for
businesses competing in a constantly changing technology landscape,” said Peter
Tung, chief operation officer of Enterprise Business Group, Wistron. “The value
proposition for AMD’s EPYC CPU, particularly in non-volatile memory storage
applications, is a major differentiator, and enables datacenter and enterprise
customers to achieve high IOPS and throughput storage solutions.”
Hardware Partner Support
Mellanox
“In
a data-centric world, we need to be able to analyze growing amounts of data and
to be able to find data insights in real time. The combination of the unmatched
data throughput and capacity of EPYC and the intelligent interconnect solutions
from Mellanox will enable our customers and partners to maximize their
application performance and overall data center return on investment.” said
Michael Kagan, chief technology officer at Mellanox Technologies. “We are happy
to be the preferred interconnect solution provider for the AMD EPYC platforms
and look forward to continuing to collaborate with AMD and the OEM partners to
enable world leading data center platforms.”
a data-centric world, we need to be able to analyze growing amounts of data and
to be able to find data insights in real time. The combination of the unmatched
data throughput and capacity of EPYC and the intelligent interconnect solutions
from Mellanox will enable our customers and partners to maximize their
application performance and overall data center return on investment.” said
Michael Kagan, chief technology officer at Mellanox Technologies. “We are happy
to be the preferred interconnect solution provider for the AMD EPYC platforms
and look forward to continuing to collaborate with AMD and the OEM partners to
enable world leading data center platforms.”
Samsung Electronics
“Samsung,
in continuing our ongoing collaboration with AMD, has been working to deliver
new leading-edge memory and flash storage solutions that will be enhanced by
EPYC,” said Jim Elliott, corporate vice president, Samsung Semiconductor,
Inc. “The industry-leading memory bandwidth and the outstanding I/O
capacity delivered by EPYC enable Samsung and AMD to collectively offer an
exceptionally high level of performance and efficiency to data center
customers. Samsung solutions combined with the power of EPYC are planned for
later this year, offering an advanced platform for in-memory database and
analytics, High Performance Computing workloads, and more.”
in continuing our ongoing collaboration with AMD, has been working to deliver
new leading-edge memory and flash storage solutions that will be enhanced by
EPYC,” said Jim Elliott, corporate vice president, Samsung Semiconductor,
Inc. “The industry-leading memory bandwidth and the outstanding I/O
capacity delivered by EPYC enable Samsung and AMD to collectively offer an
exceptionally high level of performance and efficiency to data center
customers. Samsung solutions combined with the power of EPYC are planned for
later this year, offering an advanced platform for in-memory database and
analytics, High Performance Computing workloads, and more.”
Xilinx
“The
launch of the AMD EPYC processor signifies an important milestone in the
industry,” said Victor Peng, chief operating officer at Xilinx. “Together with
Xilinx’s All Programmable devices, the EPYC platform provides outstanding
performance when accelerating data center applications. We are also delighted
to be working with AMD in furthering open data center standards, such as the
CCIX interconnect, to provide the necessary heterogeneous computing solutions
for next generation workloads.”
launch of the AMD EPYC processor signifies an important milestone in the
industry,” said Victor Peng, chief operating officer at Xilinx. “Together with
Xilinx’s All Programmable devices, the EPYC platform provides outstanding
performance when accelerating data center applications. We are also delighted
to be working with AMD in furthering open data center standards, such as the
CCIX interconnect, to provide the necessary heterogeneous computing solutions
for next generation workloads.”
About AMD
For more than 45 years AMD has driven
innovation in high-performance computing, graphics and visualization
technologies ― the building blocks for gaming, immersive platforms, and the
datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses
and cutting-edge scientific research facilities around the world rely on AMD
technology daily to improve how they live, work and play. AMD employees around
the world are focused on building great products that push the boundaries of
what is possible. For more information about how AMD is enabling today and
inspiring tomorrow, visit the AMD (NASDAQ: AMD) website, blog, and Facebook and Twitter pages.
innovation in high-performance computing, graphics and visualization
technologies ― the building blocks for gaming, immersive platforms, and the
datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses
and cutting-edge scientific research facilities around the world rely on AMD
technology daily to improve how they live, work and play. AMD employees around
the world are focused on building great products that push the boundaries of
what is possible. For more information about how AMD is enabling today and
inspiring tomorrow, visit the AMD (NASDAQ: AMD) website, blog, and Facebook and Twitter pages.
—30—
1.
Score based on AMD internal testing of 2 x EPYC 7601 CPU in, Supermicro
AS-1123US-TR4, Ubuntu 16.04, x86 Open64 v4.5.2.1 Compiler Suite, 512 GB (16 x
32 GB 2Rx4 PC4-2666) memory, 1 x 500 GB SSD.
As of May 29, 2017. See www.spec.org for more information. NAP-11
Score based on AMD internal testing of 2 x EPYC 7601 CPU in, Supermicro
AS-1123US-TR4, Ubuntu 16.04, x86 Open64 v4.5.2.1 Compiler Suite, 512 GB (16 x
32 GB 2Rx4 PC4-2666) memory, 1 x 500 GB SSD.
As of May 29, 2017. See www.spec.org for more information. NAP-11
2.
Score based on AMD internal testing of 1 x EPYC 7601 CPU in HPE
Cloudline CL3150, Ubuntu 16.04, x86 Open64 v4.5.2.1 Compiler Suite, 256 GB (8 x
32GB 2Rx4 PC4-2666) memory, 1 x 500 GB SSD.
Comparison excludes Intel Xeon Phi accelerators. As of May 29, 2017. See www.spec.org for more
information. NAP-09
Score based on AMD internal testing of 1 x EPYC 7601 CPU in HPE
Cloudline CL3150, Ubuntu 16.04, x86 Open64 v4.5.2.1 Compiler Suite, 256 GB (8 x
32GB 2Rx4 PC4-2666) memory, 1 x 500 GB SSD.
Comparison excludes Intel Xeon Phi accelerators. As of May 29, 2017. See www.spec.org for more
information. NAP-09
3.
Score based on AMD internal testing of 1 x EPYC 7601 CPU in HPE
Cloudline CL3150, Ubuntu 16.04, x86 Open64 v4.5.2.1 Compiler Suite, 256 GB (8 x
32GB 2Rx4 PC4-2666) memory, 1 x 500 GB SSD.
As of May 29, 2017. See www.spec.org for more information. NAP-10
Score based on AMD internal testing of 1 x EPYC 7601 CPU in HPE
Cloudline CL3150, Ubuntu 16.04, x86 Open64 v4.5.2.1 Compiler Suite, 256 GB (8 x
32GB 2Rx4 PC4-2666) memory, 1 x 500 GB SSD.
As of May 29, 2017. See www.spec.org for more information. NAP-10
4.
Based on
cost of 1 x EPYC 7601-based (1 x $2100 AMD 1k price) system with 256 GB (8 x
32GB 2Rx4 PC4-2666) memory (8 x $300), 1 x 500 GB SSD ($165), and chassis costs
($500) for a total system cost of $5,165; compared to 2 x E5-2660 v4-based(2 x
$1445) system with 256 GB (8 x 32GB 2Rx4 PC4-2666 running at 2133) memory (8 x
$300), 1 x 500 GB SSD ($165), and chassis costs ($500), plus Intel C612 chipset
($54 per ark.intel.com), and additional socket (est. $35), Intel Thermal Solution STS200P – processor heatsink
($34.99 per CDW), 12 FCI/Amphenol 10124677-0001001LF DIMM sockets ($5.18 each
per mouser.com), 5 x VRs (est. $3 each), power supply (est. $51), and board,
cooling and misc. components (est. $20), for a total system cost of
$6,228. NAP-08
Based on
cost of 1 x EPYC 7601-based (1 x $2100 AMD 1k price) system with 256 GB (8 x
32GB 2Rx4 PC4-2666) memory (8 x $300), 1 x 500 GB SSD ($165), and chassis costs
($500) for a total system cost of $5,165; compared to 2 x E5-2660 v4-based(2 x
$1445) system with 256 GB (8 x 32GB 2Rx4 PC4-2666 running at 2133) memory (8 x
$300), 1 x 500 GB SSD ($165), and chassis costs ($500), plus Intel C612 chipset
($54 per ark.intel.com), and additional socket (est. $35), Intel Thermal Solution STS200P – processor heatsink
($34.99 per CDW), 12 FCI/Amphenol 10124677-0001001LF DIMM sockets ($5.18 each
per mouser.com), 5 x VRs (est. $3 each), power supply (est. $51), and board,
cooling and misc. components (est. $20), for a total system cost of
$6,228. NAP-08
5.
Based on
estimated SPECint®_rate_base2006 scores.
2P Intel Xeon E5 scores other than E5-2699Av4 were derived by AMD from
the following ICC compiler-based test results published at www.spec.org,
multiplied by 0.575 to convert from the ICC compiler to the GCC-02 v6.1 compiler
used for EPYC testing: E5-2698v4=1620,
E5-2695v4=1440, E5-2680v4=1270, E5-2650v4=1000, E5-2640v4=865, E5-2630v4=814,
and E5-2620v4=683. The following EPYC 2P
scores are projections made by AMD labs (measured test data for these
pre-production products is not currently available): EPYC 7301=845, EPYC 7281=760, and EPYC
7251=485. All other scores based on AMD
internal testing. 2P E5-2699A v4 in
Intel Server System R1208WT2GSR scored 943 on 6/5/2017, with Ubuntu 16.04,
GCC-02 v6.3, 512 GB (16 x 32GB 2Rx4 PC4-2666 running at 2133), 1 x 500GB
SSD. 2P EPYC 7601 in Supermicro
AS-1123US-TR4 scored 1390, with Ubuntu 16.04, GCC-02 v6.3, 512 GB (16 x 32GB
2Rx4 PC4-2666 running at 2400), 1 x 500GB SSD.
The following EPYC 2P scores tested using AMD’s “Ethanol” reference
system with Ubuntu 16.04, GCC-02 v6.1, 512 GB (16x32GB 2Rx5 PC4-2667 running at
2400), 1 x 500GB SSD: EPYC 7551=1345,
EPYC 7451=1218, EPYC 7401=1120, EPYC 7351=939.
Based on
estimated SPECint®_rate_base2006 scores.
2P Intel Xeon E5 scores other than E5-2699Av4 were derived by AMD from
the following ICC compiler-based test results published at www.spec.org,
multiplied by 0.575 to convert from the ICC compiler to the GCC-02 v6.1 compiler
used for EPYC testing: E5-2698v4=1620,
E5-2695v4=1440, E5-2680v4=1270, E5-2650v4=1000, E5-2640v4=865, E5-2630v4=814,
and E5-2620v4=683. The following EPYC 2P
scores are projections made by AMD labs (measured test data for these
pre-production products is not currently available): EPYC 7301=845, EPYC 7281=760, and EPYC
7251=485. All other scores based on AMD
internal testing. 2P E5-2699A v4 in
Intel Server System R1208WT2GSR scored 943 on 6/5/2017, with Ubuntu 16.04,
GCC-02 v6.3, 512 GB (16 x 32GB 2Rx4 PC4-2666 running at 2133), 1 x 500GB
SSD. 2P EPYC 7601 in Supermicro
AS-1123US-TR4 scored 1390, with Ubuntu 16.04, GCC-02 v6.3, 512 GB (16 x 32GB
2Rx4 PC4-2666 running at 2400), 1 x 500GB SSD.
The following EPYC 2P scores tested using AMD’s “Ethanol” reference
system with Ubuntu 16.04, GCC-02 v6.1, 512 GB (16x32GB 2Rx5 PC4-2667 running at
2400), 1 x 500GB SSD: EPYC 7551=1345,
EPYC 7451=1218, EPYC 7401=1120, EPYC 7351=939.
Pricing
ranges based on Intel recommended customer pricing per ark.intel.com, and AMD
1Ku pricing.
ranges based on Intel recommended customer pricing per ark.intel.com, and AMD
1Ku pricing.
AMD, the AMD Arrow logo, and
combinations thereof are trademarks of Advanced Micro Devices Inc. PCIe is a
registered trademark of PCI-SIG Corporation. SPEC® and SPECint® are registered
trademarks of the Standard Performance Evaluation Corporation. Other names are
for informational purposes only and may be trademarks of their respective
owners.
combinations thereof are trademarks of Advanced Micro Devices Inc. PCIe is a
registered trademark of PCI-SIG Corporation. SPEC® and SPECint® are registered
trademarks of the Standard Performance Evaluation Corporation. Other names are
for informational purposes only and may be trademarks of their respective
owners.
CAUTIONARY STATEMENT:
This
press release contains forward-looking statements concerning Advanced Micro
Devices, Inc. (AMD) including the
features, functionality, availability, timing, customer and partner deployment,
and expected benefits of AMD EPYC products and AMD’s multi-year commitment to
delivering multiple generations of high-performance server processors, which
are made pursuant to the Safe Harbor provisions of the Private Securities
Litigation Reform Act of 1995. Forward-looking statements are commonly
identified by words such as “would,” “intends,”
“believes,” “expects,” “may,” “will,”
“should,” “seeks,” “intends,” “plans,”
“pro forma,” “estimates,” “anticipates,” or the
negative of these words and phrases, other variations of these words and
phrases or comparable terminology. Investors are cautioned that the
forward-looking statements in this document are based on current beliefs,
assumptions and expectations, speak only as of the date of this document and
involve risks and uncertainties that could cause actual results to differ
materially from current expectations. Such statements are subject to certain
known and unknown risks and uncertainties, many of which are difficult to
predict and generally beyond AMD’s control, that could cause actual results and
other future events to differ materially from those expressed in, or implied or
projected by, the forward-looking information and statements. Material factors that could cause actual results to differ
materially from current expectations include, without limitation, the
following: Intel Corporation’s dominance of the microprocessor market and its
aggressive business practices may limit AMD’s ability to compete effectively;
AMD has a wafer supply agreement with GF with obligations to purchase all of
its microprocessor and APU product requirements, and a certain portion of its
GPU product requirements, from GLOBALFOUNDRIES Inc. (GF) with limited
exceptions. If GF is not able to satisfy AMD’s manufacturing requirements, its
business could be adversely impacted; AMD relies on third parties to
manufacture its products, and if they are unable to do so on a timely basis in
sufficient quantities and using competitive technologies, AMD’s business could
be materially adversely affected; failure to achieve expected manufacturing
yields for AMD’s products could negatively impact its financial results; the
success of AMD’s business is dependent upon its ability to introduce products
on a timely basis with features and performance levels that provide value to
its customers while supporting and coinciding with significant industry
transitions; if AMD cannot generate sufficient revenue and operating cash flow
or obtain external financing, it may face a cash shortfall and be unable to
make all of its planned investments in research and development or other
strategic investments; the loss of a significant customer may have a material
adverse effect on AMD; AMD’s receipt of revenue from its semi-custom SoC
products is dependent upon its technology being designed into third-party
products and the success of those products; global economic uncertainty may
adversely impact AMD’s business and operating results; the markets in which
AMD’s products are sold are highly competitive; AMD may not be able to generate
sufficient cash to service its debt obligations or meet its working capital
requirements; AMD has a large amount of indebtedness which could adversely
affect its financial position and prevent it from implementing its strategy or
fulfilling its contractual obligations; the agreements governing AMD’s notes
and the Secured Revolving Line of Credit impose restrictions on AMD that may
adversely affect its ability to operate its business; AMD’s issuance to West
Coast Hitech L.P. (WCH) of warrants to purchase 75 million shares of its common
stock, if and when exercised, will dilute the ownership interests of its
existing stockholders, and the conversion of the 2.125% Convertible Senior
Notes due 2026 may dilute the ownership interest of its existing stockholders,
or may otherwise depress the price of its common stock; uncertainties involving
the ordering and shipment of AMD’s products could materially adversely affect
it; the demand for AMD’s products depends in part on the market conditions in
the industries into which they are sold. Fluctuations in demand for AMD’s
products or a market decline in any of these industries could have a material
adverse effect on its results of operations; AMD’s ability to design and
introduce new products in a timely manner is dependent upon third-party
intellectual property; AMD depends on third-party companies for the design,
manufacture and supply of motherboards, software and other computer platform
components to support its business; if AMD loses Microsoft Corporation’s
support for its products or other software vendors do not design and develop
software to run on AMD’s products, its ability to sell its products could be
materially adversely affected; and AMD’s reliance on third-party distributors
and AIB partners subjects it to certain risks. Investors are urged
to review in detail the risks and uncertainties in AMD’s Securities and
Exchange Commission filings, including but not limited to AMD’s Quarterly
Report on Form 10-Q for the quarter ended April 1, 2017.
press release contains forward-looking statements concerning Advanced Micro
Devices, Inc. (AMD) including the
features, functionality, availability, timing, customer and partner deployment,
and expected benefits of AMD EPYC products and AMD’s multi-year commitment to
delivering multiple generations of high-performance server processors, which
are made pursuant to the Safe Harbor provisions of the Private Securities
Litigation Reform Act of 1995. Forward-looking statements are commonly
identified by words such as “would,” “intends,”
“believes,” “expects,” “may,” “will,”
“should,” “seeks,” “intends,” “plans,”
“pro forma,” “estimates,” “anticipates,” or the
negative of these words and phrases, other variations of these words and
phrases or comparable terminology. Investors are cautioned that the
forward-looking statements in this document are based on current beliefs,
assumptions and expectations, speak only as of the date of this document and
involve risks and uncertainties that could cause actual results to differ
materially from current expectations. Such statements are subject to certain
known and unknown risks and uncertainties, many of which are difficult to
predict and generally beyond AMD’s control, that could cause actual results and
other future events to differ materially from those expressed in, or implied or
projected by, the forward-looking information and statements. Material factors that could cause actual results to differ
materially from current expectations include, without limitation, the
following: Intel Corporation’s dominance of the microprocessor market and its
aggressive business practices may limit AMD’s ability to compete effectively;
AMD has a wafer supply agreement with GF with obligations to purchase all of
its microprocessor and APU product requirements, and a certain portion of its
GPU product requirements, from GLOBALFOUNDRIES Inc. (GF) with limited
exceptions. If GF is not able to satisfy AMD’s manufacturing requirements, its
business could be adversely impacted; AMD relies on third parties to
manufacture its products, and if they are unable to do so on a timely basis in
sufficient quantities and using competitive technologies, AMD’s business could
be materially adversely affected; failure to achieve expected manufacturing
yields for AMD’s products could negatively impact its financial results; the
success of AMD’s business is dependent upon its ability to introduce products
on a timely basis with features and performance levels that provide value to
its customers while supporting and coinciding with significant industry
transitions; if AMD cannot generate sufficient revenue and operating cash flow
or obtain external financing, it may face a cash shortfall and be unable to
make all of its planned investments in research and development or other
strategic investments; the loss of a significant customer may have a material
adverse effect on AMD; AMD’s receipt of revenue from its semi-custom SoC
products is dependent upon its technology being designed into third-party
products and the success of those products; global economic uncertainty may
adversely impact AMD’s business and operating results; the markets in which
AMD’s products are sold are highly competitive; AMD may not be able to generate
sufficient cash to service its debt obligations or meet its working capital
requirements; AMD has a large amount of indebtedness which could adversely
affect its financial position and prevent it from implementing its strategy or
fulfilling its contractual obligations; the agreements governing AMD’s notes
and the Secured Revolving Line of Credit impose restrictions on AMD that may
adversely affect its ability to operate its business; AMD’s issuance to West
Coast Hitech L.P. (WCH) of warrants to purchase 75 million shares of its common
stock, if and when exercised, will dilute the ownership interests of its
existing stockholders, and the conversion of the 2.125% Convertible Senior
Notes due 2026 may dilute the ownership interest of its existing stockholders,
or may otherwise depress the price of its common stock; uncertainties involving
the ordering and shipment of AMD’s products could materially adversely affect
it; the demand for AMD’s products depends in part on the market conditions in
the industries into which they are sold. Fluctuations in demand for AMD’s
products or a market decline in any of these industries could have a material
adverse effect on its results of operations; AMD’s ability to design and
introduce new products in a timely manner is dependent upon third-party
intellectual property; AMD depends on third-party companies for the design,
manufacture and supply of motherboards, software and other computer platform
components to support its business; if AMD loses Microsoft Corporation’s
support for its products or other software vendors do not design and develop
software to run on AMD’s products, its ability to sell its products could be
materially adversely affected; and AMD’s reliance on third-party distributors
and AIB partners subjects it to certain risks. Investors are urged
to review in detail the risks and uncertainties in AMD’s Securities and
Exchange Commission filings, including but not limited to AMD’s Quarterly
Report on Form 10-Q for the quarter ended April 1, 2017.
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