GIGABYTE has introduced its latest flagship AM5 motherboard, which is the X870E X3D series, that is made to deliver top-tier performance, advanced thermal engineering, and builder-focused innovations for enthusiasts, gamers, and professionals.
To unleash the full potential of the AMD Ryzen 9000 X3D lineup of CPUs, the motherboard comes with X3D Turbo Mode 2.0, which is an AI-driven optimization feature that dynamically boosts gaming performance by up to 25% depending on workload. Complementing it is D5 Bionic Corsa technology, which combines AI, software, hardware, and firmware enhancements to push DDR5 memory speeds to 9000 MT/s, ensuring both stability and speed.
The motherboard also introduces PCB Back Drilling Technology with an 8-layer PCB, improving signal integrity and reducing electromagnetic interference, while a digital twin 18+2+2 phase VRM solution supplies stable power to AMD Ryzen 9000, 8000, and 7000 Series processors.
For cooling, there’s the VRM Thermal Armor Advanced with direct-touch heatpipes, a PCB Thermal Plate for a 14% improvement in thermal efficiency, and M.2 EZ-Flex technology for effective SSD heat dissipation.
Installation and usability have also been a focus, with features such as PCIe EZ-Latch Plus Duo for tool-free GPU removal, Rear EZ-Button controls for quick system management, Wi-Fi EZ-Plug for simplified antenna installation, and the redesigned UC BIOS 2.0 offering quick search, one-click screenshots, and improved diagnostics.
Lastly, connectivity options include dual USB4 Type-C ports with DisplayPort Alt mode, 10GbE + 5GbE LAN, Wi-Fi 7 with a directional high-gain antenna, HDMI output, and front-panel Quick Charge USB delivering up to 65W.
Availability
GIGABYTE is currently shipping the X870E X3D series worldwide, but as usual, it is subject to local availability.
