Micron unveiled the latest and the most compact UFS 4.0 mobile storage solution ever just last week. Reading just the title would have forgo so many details as it is not only cutting down in size while maintaining the standard…
Micron’s LPCAMM2 technology shrinks LPDDR5X RAM chips down to an even smaller size while amping power efficiency and performance
The latest announcement from Micron comes from the breakthrough in RAM technology where they have successfully produced LPDDR5X memory modules via the LPCAMM2 standard. The new disruptive form factor mainly aims for reduced space consumption compared to the traditional SODIMM…
Micron’s new HBM3 memory chips are bigger and faster than anyone else in the market right now
Micron just dropped the big bomb in the HBM space by announcing the new 8-high 24GB HBM3 Gen2 memory. Equipped with 50% improvement over the currently available HBM3 solutions at 1.2+TBps bandwidth and 9.2+Gbps pin speed, the performance gains are…
Micron DDR5 Delivers Increased Performance and Reliability for the 4th Gen Intel® Xeon® Scalable Processor Family
Singapore, Jan. 11, 2023 – Micron Technology, Inc. (Nasdaq: MU), yesterday announced that its DDR5 server memory portfolio for the data center is now fully validated on the 4th Gen Intel Xeon Scalable processor family. Micron DDR5 memory delivers up to twice the memory bandwidth over…
Micron’s Sustainability Initiatives Boost Production Output
Micron is a technology company that specializes in the design, development, and production of memory and storage solutions. Its products include dynamic random-access memory (DRAM), NAND flash memory, and solid-state drives (SSDs), among others. Micron’s products are used in a…
Micron Delivers the World’s Most Advanced Client SSD Featuring 232-Layer NAND Technology
New Micron 2550 SSD brings outstanding PCIe Gen4 performance and superior user experience BOISE, Idaho, Dec. 06, 2022 (GLOBE NEWSWIRE) — Micron Technology, Inc., (Nasdaq: MU), today announced it is shipping the Micron 2550 NVMe™ SSD to global PC OEM…
Micron Ships World’s Most Advanced DRAM Technology With 1-Beta Node
Cutting-edge process technology underpins LPDDR5X, now sampling to mobile ecosystem SINGAPORE, Nov. 2, 2022 – Micron Technology, Inc. (Nasdaq: MU), announced today that it is shipping qualification samples of its 1β (1-beta) DRAM technology to select smartphone manufacturers and chipset partners and has…
Micron Ships World’s First 232-Layer NAND, Extends Technology Leadership
Singapore, July 27, 2022 – Micron Technology, Inc. (Nasdaq: MU), today announced that it has begun volume production of the world’s first 232-layer NAND, built with industry-leading innovations to drive unprecedented performance for storage solutions. It features the industry’s highest areal density and delivers higher…
Micron Delivers World’s Most Advanced 176-Layer NAND Data Center SSD
Micron Technology, Inc. (Nasdaq: MU), today announced it is sampling the world’s first vertically-integrated 176-layer NAND solid-state drive (SSD) for the data center. The Micron 7450 SSD with NVMeTM delivers quality-of-service (QoS) latency at or below 2 milliseconds (ms),1 a…
Micron Launches World’s First 176-Layer NAND in Mobile Solutions to Power Lightning-Fast 5G Experiences
Singapore, July 30, 2021 — Micron Technology, Inc., (Nasdaq: MU) announced today it has begun volume shipments of the world’s first 176-layer NAND Universal Flash Storage (UFS) 3.1 mobile solution. Engineered for high-end and flagship phones, Micron’s discrete UFS 3.1 mobile NAND unlocks 5G’s potential…
Micron President and CEO Sanjay Mehrotra to Keynote at 2021 COMPUTEX Forum on Memory and Storage Innovation
May 25, 2021, Taipei – TAITRA (Taiwan External Trade Development Council) announced today that Sanjay Mehrotra, President and Chief Executive Officer of Micron, is invited to be the opening keynote speaker at 2021 COMPUTEX Forum. This digital keynote will be…
Micron Delivers Industry’s First 1α DRAM Technology
Singapore, Jan. 27, 2021 — Micron Technology, Inc. (Nasdaq: MU), today announced volume shipment of 1α (1-alpha) node DRAM products built using the world’s most advanced DRAM process technology and offering major improvements in bit density, power and performance. This milestone reinforces…
Micron Ships World’s First 176-Layer NAND, Delivering A Breakthrough in Flash Memory Performance and Density
BOISE, Idaho, Nov. 9, 2020 — Micron Technology, Inc. (Nasdaq: MU), today announced shipment of the world’s first 176-layer 3D NAND flash memory, achieving unprecedented, industry-pioneering density and performance. Together, Micron’s new 176-layer technology and advanced architecture represent a radical breakthrough, enabling immense gains in…
World’s Fastest Discrete Graphics Memory From Micron Powers NVIDIA’s Breakthrough Gaming Speeds
Singapore, September 2, 2020 — Micron Technology, Inc. (Nasdaq: MU), today announced the world’s fastest discrete graphics memory solution, GDDR6X, the first to power system bandwidth up to 1 terabyte per second (TB/s). Working with visual computing technology leader NVIDIA, Micron debuted…
Micron Delivers Client NVMe™ Performance and Value SSDs With Industry-Leading Capacity Sizes and QLC NAND
New mainstream and value SSD options provide flexibility to address client PC systems ranging from thin and light notebooks to high-performance workstations. Micron 2300 SSD’s M.2 form factor delivers industry-leading 2TB capacity1 using Micron’s innovative 96-layer 3D NAND technology. Designed with…