Solidigm has unveiled what it calls the industry’s first liquid-cooled enterprise SSD, the D7-PS1010, targeting the demands of AI datacenters.
The drive is built in the compact E1 form factor with a PCIe 5.0 interface and features a cold plate that fully encloses the SSD, complete with hose connectors for a hot-swappable liquid cooling solution.
The company is positioning the D7-PS1010 for Direct-Attached Storage deployments in AI servers, and is working with Supermicro to integrate the technology. Supermicro noted that the E1.S variant of the SSD is well-suited for its Nvidia HGX B300-based systems, while Solidigm emphasized that the hot-swap design offers easier maintenance compared to conventional liquid-cooled solutions.
By cooling both sides of the PCB, the D7-PS1010 improves thermal efficiency over fan-based methods, potentially enabling datacenter operators to eliminate fans in storage racks altogether. This could pave the way for more compact server layouts while reducing power draw associated with cooling infrastructure.
The SSD will ship in two versions: a 3.84 TB model at 9.5 mm and a 7.68 TB model at 15 mm, both using 176-layer TLC 3D NAND. Performance figures include sequential read speeds up to 14,500 MB/s and writes up to 8,400 MB/s, with random read IOPS at 3.2 million and writes at 315,000. Endurance is rated at 1 DWPD, equating to 7 PBW, with MTBF at 2.5 million hours and warranty coverage for five years.
