AMD has announced the latest generation of 5th Gen AMD EPYC Embedded 9005 Series CPUs made for the embedded markets for high-performance computing with extended product longevity, system resiliency, and simplified embedded application development.
These new chips start from 8 cores and go all the way up to 192 in a single socket, allowing businesses of all sizes, from small to large-scale industrial settings, to benefit from them with up to 1.3x and 1.6x improvements in data processing throughput for networking and storage workloads, respectively. And the best thing – it is still using SP5 socket so if you want to upgrade from EPYC Embedded 9004, you can do so seamlessly.
The series also supports up to 6TB of DDR5 memory per socket as well as 160 PCIe 5.0 lanes with CXL 2.0 support for high-speed data transfer and storage expansion.
In collaboration with OEMs and ODMs like Cisco and IBM, these EPYC Embedded 9005 Series will be integrated into enterprise solutions, including the former’s high-end firewall products due to its scalability, high memory, and I/O bandwidth and the latter’s Storage Scale System 6000 for AI and high-performance computing applications, benefiting from redundant data paths and robust connectivity.
Here are some of the specific features and offerings provided by these embedded processors:
- Extended Longevity: Offers 7-year product manufacturing support to ensure long-term availability, minimizing system redesign and qualification efforts.
- System Resiliency & Security:
- Non-Transparent Bridging (NTB): Enhances fault tolerance in multi-host configurations by enabling active-active CPU redundancy.
- DRAM Flush: Prevents data loss during power failures by transferring data to non-volatile memory.
- Dual SPI: Supports secure bootloader authentication for a trusted execution environment.
- Ease of Application Development:
- Built-in Yocto framework support simplifies Linux-based embedded system development.
- SPDK (Storage Performance Development Kit) and DPDK (Data Plane Development Kit) optimize storage and networking workloads.
Early sampling is currently happening with production shipments to start in Q2 2025.
