GIGABYTE unveiled its Intel B860 and AMD B850 series motherboards at CES 2025, showcasing a strong lineup tailored for mid-range gaming and PC-building enthusiasts. These motherboards are designed to complement the latest Intel Core Ultra and AMD Ryzen processors, offering AI-enhanced features and user-centric designs.
The new models boast ultra-durable components and the innovative AI suite, D5 Bionics Corsa. This technology integrates hardware, software, and firmware to push DDR5 memory speeds to 8600MT/s on AMD B850 motherboards and 9466MT/s on Intel B860 motherboards. Another standout feature, AI Snatch, previously exclusive to high-end models, has been included to simplify DDR5 performance enhancements. Additionally, the AI-driven PCB design ensures superior multi-layer performance by reducing signal reflection.
Intel B860 boards benefit from HyperTune BIOS, which leverages AI to optimize platform performance, while AMD B850 boards feature X3D Turbo Mode, focusing on CPU core optimization. Thermal efficiency is also a priority, with a redesigned heatsink that offers a 4x increase in cooling surface area, integrated heat pipes, and high-conductivity thermal pads for enhanced heat dissipation.
DIY enthusiasts will appreciate features like PCIe EZ-Latch Plus, M.2 EZ-Latch Click, and WIFI EZ-PLUG, which simplify installation and setup. The product range includes the AORUS PRO and ELITE models, GIGABYTE GAMING(X), EAGLE series, and the ICE series, which caters to white-themed builds with its white PCB and matching components. Advanced users can explore the GIGABYTE B850 AI TOP model, which supports local AI fine-tuning through the AI TOP utility.
